Supply of Semiconductor Dicing and Grinding Systems

Complete

Value

£350,000

Classifications

  • Laboratory, optical and precision equipments (excl. glasses)

Tags

  • tender

Submission Deadline

3 years ago

Published

3 years ago

Description

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System.  These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots

Documents

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  • Contract Agreement

    The official contract terms, conditions, and scopes of work.

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  • Award Notice

    Details on the tender award and selected suppliers.

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Organisation

James Thomas

[email protected]

+44 1792602779

+44 2079477501

Timeline complete