Supply of Semiconductor Dicing and Grinding Systems

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Buyers

Value

£382,574

Suppliers

Disco HI-TEC UK LTD

Classifications

Laboratory, optical and precision equipments (excl. glasses)

Tags

award
contract

Published

3 years ago

Description

This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System.  These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots

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Organisation

Swansea University

Body governed by public law

James Thomas

[email protected]

+44 1792602779

+44 4989909030

+44 2079477501

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